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Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB 2 (PDF) – 236th ECS Meeting

Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB 2 (PDF) – 236th ECS Meeting

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Quick Overview:
This issue of ECS Transactions includes papers based on presentations from the symposium "Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB 2," originally held at the 236th ECS Meeting in Atlanta, Georgia, October 13-17, 2019.
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$56.33 - Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB 2 (PDF) – 235th ECS Meeting

ISBN:978-1-60768-879-2
Year published:2019
Authors/Editors:W.-P. Dow, K. Kondo, M. Hayase, U. Cvelbar, F. Roozeboom
Event Title:236th ECS Meeting: Atlanta, GA
Format:PDF
Product Code:T201909205PDF
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This issue of ECS Transactions includes papers based on presentations from the symposium "Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB 2," originally held at the 236th ECS Meeting in Atlanta, Georgia, October 13-17, 2019.
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