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Semiconductor Wafer Bonding 13: Science, Technology, and Applications – 226th ECS Meeting

Semiconductor Wafer Bonding 13: Science, Technology, and Applications – 226th ECS Meeting

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$121.57 - Semiconductor Wafer Bonding 13: Science, Technology, and Applications – 226th ECS Meeting

$97.26 - Semiconductor Wafer Bonding 13: Science, Technology, and Applications – 226th ECS Meeting

ISBN:978-1-60768-542-5
Number of pages:405
Year published:2014
Authors/Editors:H. Moriceau, H. Baumgart, M. S. Goorsky, K. Hobart, R. Knechtel, T. Suga, C. S. Tan
Event Title:226th ECS Meeting: 2014 ECS and SMEQ Joint International Meeting: Cancun, Mexico
Format:PDF
Product Code:T201406405
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