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ULSI Process Integration 6 – 216th ECS Meeting

ULSI Process Integration 6 – 216th ECS Meeting

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Quick Overview:
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
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$109.67 - ULSI Process Integration 6

$87.74 - ULSI Process Integration 6

ISBN:978-1-60768-094-9
Number of pages:533
Year published:2009
Authors/Editors:Claeys, Iwai, Tao, Deleonibus, and Murota
Event Title:216th ECS Meeting: EuroCVD 17 & SOFC-XI: Vienna, Austria
Format:PDF
Product Code:T200902507
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