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Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 – 226th ECS Meeting

Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 – 226th ECS Meeting

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Papers from this issue of ECS Transactions were presented at the 226th ECS meeting in Cancun, Mexico on Oct. 5-9, 2014.
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$57.75 - Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6

$46.20 - Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6

ISBN:978-1-60768-620-0
Number of pages:132
Edition: 1st
Year published:2014
Authors/Editors:K. Kondo, R. Akolkar, D. P. Barkey, W.-P.Dow, M. Hayase, M. Koyanagi, S. Mathad, P.Ramm, F. Roozeboom, S. Shingubara
Event Title:226th ECS Meeting: 2014 ECS and SMEQ Joint International Meeting: Cancun, Mexico
Format:PDF
Product Code:T201406440
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Papers from this issue of ECS Transactions were presented at the 226th ECS meeting in Cancun, Mexico on Oct. 5-9, 2014.
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