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Semiconductor Wafer Bonding: Science, Technology, and Applications 15 (PDF)

Semiconductor Wafer Bonding: Science, Technology, and Applications 15 (PDF)

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The papers included in this issue of ECS Transactions were originally presented in the symposium "Semiconductor Wafer Bonding: Science, Technology, and Applications 15," held during the AiMES 2018, ECS and SMEQ Joint International Meeting, in Cancun, Mexico, from September 30 – October 4, 2018.
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$118.09 - Semiconductor Wafer Bonding: Science, Technology, and Applications 15 (PDF)

$94.47 - Semiconductor Wafer Bonding: Science, Technology, and Applications 15 (PDF)

ISBN:978-1-60768-851-8
Year published:2018
Authors/Editors:C. S. Tan, T. Suga, H. Baumgart, F. Fournel, M. Goorsky, K. D. Hobart, R. Knechtel
Event Title:AiMES 2018
Format:PDF
Product Code:T201808605PDF
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Description
The papers included in this issue of ECS Transactions were originally presented in the symposium "Semiconductor Wafer Bonding: Science, Technology, and Applications 15," held during the AiMES 2018, ECS and SMEQ Joint International Meeting, in Cancun, Mexico, from September 30 – October 4, 2018.
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