Skip to main content
My Account
(Print on Demand) Semiconductor Wafer Bonding: Science, Technology and Applications 16 - PRiME 2020

(Print on Demand) Semiconductor Wafer Bonding: Science, Technology and Applications 16 - PRiME 2020

Available
Rating: 0 out of 5
  • 1
  • 2
  • 3
  • 4
  • 5
No Reviews
Quick Overview:
Price:

$104.00 - (Print on Demand) Semiconductor Wafer Bonding: Science, Technology and Applications 16 - PRiME 2020

$73.22 - (Print on Demand) Semiconductor Wafer Bonding: Science, Technology and Applications 16 - PRiME 2020

ISBN: 9781713819363
Number of pages:225
Year published:2020
Authors/Editors:Roy Knechtel, Chuan Seng Tan, Tadatomo Suga, Helmut Baumgart, Mark Goorsky, Frank Fournel, Karl D. Hobart
Event Title:PRiME 2020
Format:Print-on-Demand/Softcover
Product Code:T202009804POD
Share it:
Add to Cart
104.00
Required
Description
Proceedings of a meeting held 4-9 October 2020, Honolulu, Hawaii, USA. PRiME 2020 - Held online due to COVID-19
We're sorry, but there is no inventory for the product you selected. Check out these other great products:

Related Products

    Other Purchased Products

      Reviews

      No records found.

        ©  The Electrochemical Society, All Rights Reserved.
        65 South Main Street, Building D, Pennington, New Jersey 08534-2839, USA