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For more than a decade, the Chemical Mechanical Polishing Symposium has established a tradition of excellence in the field of CMP for addressing both fundamentals and applications of CMP in a wide range of materials (metals, dielectrics, semiconductor substrates, and more). Presentations at CMP 12 included the following specific areas: (1.) CMP fundamental science and technology; (2.) surface and electrochemical aspects of CMP; (3.) CMP of metals and composites; (4.) CMP of dielectrics and semiconductors; (5.) advances in CMP consumables; (6.) CMP for 3D integration and packaging; and (7.) CMP for new and emerging materials.