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Semiconductor Wafer Bonding: Science, Technology and Applications 14 – 230th ECS Meeting/PRiME 2016

Semiconductor Wafer Bonding: Science, Technology and Applications 14 – 230th ECS Meeting/PRiME 2016

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Quick Overview:
This issue of ECS Transactions will be focused on topics relevant to their symposium. The papers included in this issue of ECST were originally presented during the 230th meeting of The Electrochemical Society, in Honolulu, HI, from October 2-7, 2016.
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$141.00 - Semiconductor Wafer Bonding: Science, Technology and Applications 14

$113.00 - Semiconductor Wafer Bonding: Science, Technology and Applications 14

ISBN:978-1-62332-368-4
Edition: 1st
Year published:2016
Authors/Editors:T. Suga, H. Baumgart, F. Fournel, M. S. Goorsky, K. D. Hobart, R. Knechtel, and C. Seng Tan
Event Title:PRiME 2016
Format:CD
Product Code:T201607509CD
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