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Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7 – 228th ECS Meeting

Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7 – 228th ECS Meeting

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Quick Overview:
This issue of ECS Transactions will be focused on topics relevant to their symposium. The papers included in this issue of ECST were originally presented during the 228th meeting of The Electrochemical Society, in Phoenix, AZ, from October 11 to October 16, 2015.

CD/USB Edition: $119.00 list price

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$119.00 - Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7

$96.00 - Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7

ISBN:978-1-62332-313-4
Number of pages:211
Year published:2015
Authors/Editors:Kondo, Mathad, Akolkar, Dow, Philipsen, Hayase, Koyanagi, Kaneko, and Roozeboom
Event Title:228th ECS Meeting: Phoenix, Arizona
Format:CD
Product Code:T201506906CD
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