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Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7 – 228th ECS Meeting

Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7 – 228th ECS Meeting

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Quick Overview:
The papers included in this issue of ECS Transactions were originally presented during the 228th meeting of The Electrochemical Society, which took place October 11-15, 2015, in Phoenix, AZ.
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$77.07 - Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7

$61.66 - Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7

ISBN:978-1-60768-671-2
Number of pages:111
Year published:2015
Authors/Editors:K. Kondo, G. S. Mathad, R. Akolkar, W-P.Dow, Harold Philipsen, M. Hayase, M. Koyanagi, Yutaka Kaneko, F. Roozeboom
Event Title:228th ECS Meeting: Phoenix, Arizona
Format:PDF
Product Code:T201506906
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The papers included in this issue of ECS Transactions were originally presented during the 228th meeting of The Electrochemical Society, which took place October 11-15, 2015, in Phoenix, AZ.
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