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Processing, Materials, and Integration of Damascene and 3D Interconnects – 216th ECS Meeting

Processing, Materials, and Integration of Damascene and 3D Interconnects – 216th ECS Meeting

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Quick Overview:
This issue focuses on recent advances in damascene interconnects and 3D interconnects.
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$63.20 - Processing, Materials, and Integration of Damascene and 3D Interconnects

$50.56 - Processing, Materials, and Integration of Damascene and 3D Interconnects

ISBN:978-1-56677-812-1
Number of pages:161
Year published:2010
Authors/Editors:Flake, Roozeboom, Ramm, Mathad, Rathore, and Leonte
Event Title:216th ECS Meeting: EuroCVD 17 & SOFC-XI: Vienna, Austria
Format:PDF
Product Code:T200902538
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