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Molecular Structure of the Solid-Liquid Interface and its Relationship to Electrodeposition 6 – 214th ECS Meeting/PRiME 2008

Molecular Structure of the Solid-Liquid Interface and its Relationship to Electrodeposition 6 – 214th ECS Meeting/PRiME 2008

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The papers included in this issue of ECS Transactions were originally presented in the symposium “Molecular Structure of the Solid-Liquid Interface and Its Relationship to Electrodeposition 6”, held during the PRiME 2008 joint international meeting of The Electrochemical Society and The Electrochemical Society of Japan, with the technical cosponsorship of the Japan Society of Applied Physics, the Korean Electrochemical Society, the Electrochemistry Division of the Royal Australian Chemical Institute, and the Chinese Society of Electrochemistry. This meeting was held in Honolulu, Hawaii, from October 12 to 17, 2008.
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$41.39 - Molecular Structure of the Solid-Liquid Interface and its Relationship to Electrodeposition 6

$33.11 - Molecular Structure of the Solid-Liquid Interface and its Relationship to Electrodeposition 6

ISBN:978-1-56677-731-5
Number of pages:117
Year published:2009
Authors/Editors:Fukunaka and Homma
Event Title:214th ECS Meeting : 2008 Fall Meeting of ECSJ : PRiME 2008 : Honolulu, Hawaii
Format:PDF
Product Code:T200801646
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