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Copper Interconnects, New Contact and Barrier Metallurgies/Structures, and Low-k Inter-level Dielectrics III – 208th ECS Meeting

Copper Interconnects, New Contact and Barrier Metallurgies/Structures, and Low-k Inter-level Dielectrics III – 208th ECS Meeting

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Quick Overview:
Copper wiring and low-k dielectric films, having become the new materials of choice to reduce RC delays and increase signal speed in integrated circuits, have been discussed by several researchers from the international community of universities and industries, and are covered in this issue.

Electronic (PDF) Edition: $54.75 list price

Individual papers, and/or a full issue PDF file are available for purchase here

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$54.75 - Copper Interconnects, New Contact and Barrier Metallurgies/Structures, and Low-k Inter-level Dielectrics III

$43.80 - Copper Interconnects, New Contact and Barrier Metallurgies/Structures, and Low-k Inter-level Dielectrics III

ISBN:978-1-56677-499-4
Number of pages:194
Year published:2006
Authors/Editors:Mathad, Engelhardt, Kondo, and Rathore
Event Title:208th ECS Meeting: Los Angeles, California
Format:PDF
Product Code:T200500111
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