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Processing, Materials, and Integration of Damascene and 3D Interconnects – 218th ECS Meeting

Processing, Materials, and Integration of Damascene and 3D Interconnects – 218th ECS Meeting

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Quick Overview:
The papers included in this issue of ECS Transactions were originally presented in the symposium “Processing, Materials, and Integration of Damascene and 3D Interconnects”, held during the 218th meeting of The Electrochemical Society, in Las Vegas, Nevada from October 10 to 15, 2010.
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$43.19 - Processing, Materials, and Integration of Damascene and 3D Interconnects

ISBN:978-1-56677-831-2
Number of pages:164
Year published:2010
Authors/Editors:Flake, Ritzdorf, Koyangi, Leonte, Mathad, Ramm, Rathore, Roozeboom
Event Title:218th ECS Meeting: Las Vegas, NV
Format:PDF
Product Code:T201003312
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