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Processing, Materials, and Integration of Damascene and 3D Interconnects 5 – 224th ECS Meeting

Processing, Materials, and Integration of Damascene and 3D Interconnects 5 – 224th ECS Meeting

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Quick Overview:
The papers included in this issue of ECS Transactions were originally presented in the symposium “Processing, Materials, and Integration of Damascene and 3D Interconnects 5”, held during the 224th meeting of The Electrochemical Society, in San Francisco, CA from October 27 to November 1, 2013.
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$41.05 - Processing, Materials, and Integration of Damascene and 3D Interconnects 5

ISBN:978-1-60768-495-4
Number of pages:110
Year published:2014
Authors/Editors:Misra
Event Title:224th ECS Meeting: San Francisco, California
Format:PDF
Product Code:T201305817
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