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Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7 – 231st ECS Meeting

Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7 – 231st ECS Meeting

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The papers included in this issue of ECS Transactions were originally presented in the symposium “Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7”, held during the 231st meeting of The Electrochemical Society, in New Orleans, LA, from May 28-June 1, 2017.
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$95.33 - Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7

$74.84 - Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7

ISBN:978-1-60768-808-2
Number of pages:279
Year published:2017
Authors/Editors:F. Roozeboom, H. Jagannathan, K. Kakushima, P. J. Timans, E. P. Gusev, Z. Karim, and S. De Gendt
Event Title:231st ECS Meeting: New Orleans, LA
Format:PDF
Product Code:T201707705PDF
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The papers included in this issue of ECS Transactions were originally presented in the symposium “Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7”, held during the 231st meeting of The Electrochemical Society, in New Orleans, LA, from May 28-June 1, 2017.
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