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ULSI Process Integration 7 – 220th ECS Meeting

ULSI Process Integration 7 – 220th ECS Meeting

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Quick Overview:
The proceedings of the Seventh symposium on ULSI Process Integration discusses all aspects of process integration. Covered areas include device technologies, 3D integration schemes, memory technologies, gate dielectrics, source-drain engineering, rapid thermal annealing, CMP issues, barrier materials and copper interconnects, multilevel integration structures, packaging concepts for TSV based technologies and SIPs, Ge and III-V technologies, novel memory elements, emerging devices, carbon naotubes, spintronics and polymer electronics.
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$119.73 - ULSI Process Integration 7

$95.78 - ULSI Process Integration 7

ISBN:978-1-60768-261-5
Number of pages:442
Year published:2011
Authors/Editors:Claeys, Iwai, Tao, Deleonibus, and Murota
Event Title:220th ECS Meeting: Boston, MA
Format:PDF
Product Code:T201104107
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