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Semiconductor Wafer Bonding 12: Science, Technology, and Applications – 222nd ECS Meeting/PRiME 2012

Semiconductor Wafer Bonding 12: Science, Technology, and Applications – 222nd ECS Meeting/PRiME 2012

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Quick Overview:
This issue of ECS Transactions includes theoretical and experimental papers that document new developments and cover the full range of basic science, process technologies, and product applications of semiconductor wafer bonding. Fundamental aspects include the influence of surface treatments on bonding and wafer splitting, low temperature bonding, surface activation of bonding interfaces, molecular wafer bonding and bonding of novel materials composites.


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$133.37 - Semiconductor Wafer Bonding 12: Science, Technology, and Applications

$106.70 - Semiconductor Wafer Bonding 12: Science, Technology, and Applications

ISBN:978-1-60768-355-1
Number of pages:470
Year published:2012
Authors/Editors:Goorsky, Colinge, Knechtel, Baumgart, Hobart, Moriceau, Suga
Event Title:222nd ECS Meeting: 2012 Fall Meeting of ECSJ: PRiME 2012: Honolulu, HI
Format:PDF
Product Code:T201205007
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