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Semiconductor Wafer Bonding 13: Science, Technology, and Applications – 226th ECS Meeting

Semiconductor Wafer Bonding 13: Science, Technology, and Applications – 226th ECS Meeting

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Quick Overview:
Semiconductor wafer bonding technologies continue to evolve allowing more and more crucial product process steps. Science, technology and application aspects enable innovative developments in product architectures and new integration and processing schemes for microelectronics, photonics, MEMS, micro- and nanotechnologies, 3D device integration and other relevant applications. This symposium brought together materials, device and process engineers from these and related interdisciplinary areas.
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$134.00 - Semiconductor Wafer Bonding 13: Science, Technology, and Applications

$107.00 - Semiconductor Wafer Bonding 13: Science, Technology, and Applications

ISBN:978-1-62332-185-7
Year published:2014
Authors/Editors:Moriceau, Baumgart, Goorsky, Hobart, Knechtel, Suga, Tan
Event Title:226th ECS Meeting: 2014 ECS and SMEQ Joint International Meeting: Cancun, Mexico
Format:Hardcover
Product Code:T201406405HC
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