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Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele – 218th ECS Meeting

Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele – 218th ECS Meeting

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$151.61 - Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele

$121.29 - Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele

ISBN:978-1-60768-173-1
Number of pages:640
Year published:2010
Authors/Editors:C. Colinge, J. Bagdahn, H. Baumgart, K. D. Hobart, H. Moriceau, T. Suga
Event Title:218th ECS Meeting: Las Vegas, NV
Format:PDF
Product Code:T201003304
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