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(Print on Demand) Semiconductor Wafer Bonding: Science, Technology and Applications 16 - PRiME 2020

(Print on Demand) Semiconductor Wafer Bonding: Science, Technology and Applications 16 - PRiME 2020

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$104.00 - (Print on Demand) Semiconductor Wafer Bonding: Science, Technology and Applications 16 - PRiME 2020

$73.22 - (Print on Demand) Semiconductor Wafer Bonding: Science, Technology and Applications 16 - PRiME 2020

ISBN: 9781713819363
Number of pages:225
Year published:2020
Authors/Editors:Roy Knechtel, Chuan Seng Tan, Tadatomo Suga, Helmut Baumgart, Mark Goorsky, Frank Fournel, Karl D. Hobart
Event Title:PRiME 2020
Format:Print-on-Demand/Softcover
Product Code:T202009804POD
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Proceedings of a meeting held 4-9 October 2020, Honolulu, Hawaii, USA. PRiME 2020 - Held online due to COVID-19
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