Skip to main content
My Account
Chemical Mechanical Polishing 12 – 222nd ECS Meeting/PRiME 2012

Chemical Mechanical Polishing 12 – 222nd ECS Meeting/PRiME 2012

Rating: 0 out of 5
  • 1
  • 2
  • 3
  • 4
  • 5
No Reviews
Quick Overview:
For more than a decade, the Chemical Mechanical Polishing Symposium has established a tradition of excellence in the field of CMP for addressing both fundamentals and applications of CMP in a wide range of materials (metals, dielectrics, semiconductor substrates, and more). Presentations at CMP 12 included the following specific areas: (1.) CMP fundamental science and technology; (2.) surface and electrochemical aspects of CMP; (3.) CMP of metals and composites; (4.) CMP of dielectrics and semiconductors; (5.) advances in CMP consumables; (6.) CMP for 3D integration and packaging; and (7.) CMP for new and emerging materials.


$40.13 - Chemical Mechanical Polishing 12

$32.10 - Chemical Mechanical Polishing 12

Number of pages:91
Year published:2013
Authors/Editors:Rhoades, Banerjee, Basim, Economikos, Huang, Obeng, Ali
Event Title:222nd ECS Meeting: 2012 Fall Meeting of ECSJ: PRiME 2012: Honolulu, HI
Product Code:T201205039
Share it:
Add to Cart
We're sorry, but there is no inventory for the product you selected. Check out these other great products:

Related Products

    Other Purchased Products


      No records found.

        ©  The Electrochemical Society, All Rights Reserved.
        65 South Main Street, Building D, Pennington, New Jersey 08534-2839, USA