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(Print on Demand) Semiconductor Wafer Bonding 9: Science, Technology, and Applications – 210th ECS Meeting

(Print on Demand) Semiconductor Wafer Bonding 9: Science, Technology, and Applications – 210th ECS Meeting

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$84.00 - (Print on Demand) Semiconductor Wafer Bonding 9: Science, Technology, and Applications – 210th ECS Meeting

$67.20 - (Print on Demand) Semiconductor Wafer Bonding 9: Science, Technology, and Applications – 210th ECS Meeting

ISBN:978-1-51086-654-6
Number of pages:386
Year published:2006
Authors/Editors:Baumgart, H. et al.
Event Title:210th ECS Meeting: Cancun, Mexico
Format:Print-on-Demand/Softcover
Product Code:T200600306POD
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