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Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB (PDF)

Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB (PDF)

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Quick Overview:
The papers included in this issue of ECS Transactions were originally presented in the symposium "Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB," held during the AiMES 2018, ECS and SMEQ Joint International Meeting, in Cancun, Mexico, from September 30 – October 4, 2018.
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$99.06 - Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB (PDF)

$79.25 - Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB (PDF)

ISBN:978-1-60768-854-9
Year published:2018
Authors/Editors:W.-P. Dow, G. S. Mathad, K. Kondo, M. Hayase, M. Koyanagi, F. Roozeboom, R. Akolkar, S. Armini, Y. Takeno, L. Wei
Event Title:AiMES 2018
Format:PDF
Product Code:T201808608PDF
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The papers included in this issue of ECS Transactions were originally presented in the symposium "Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB," held during the AiMES 2018, ECS and SMEQ Joint International Meeting, in Cancun, Mexico, from September 30 – October 4, 2018.
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