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Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB (USB)

Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB (USB)

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Quick Overview:
This is a pre-order for the USB edition of  ECS Transactions 86-8: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB.
 
This issue will be available for pick up at the AiMES 2018 ECS and SMEQ Joint International Meeting, to be held in Cancun, Mexico, September 30 – October 4, 2018. This item will not be shipped.
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ISBN:978-1-62332-542-8
Year published:2018
Authors/Editors:W.-P. Dow, G. S. Mathad, K. Kondo, M. Hayase, M. Koyanagi, F. Roozeboom, R. Akolkar, S. Armini, Y. Takeno, L. Wei
Event Title:AiMES 2018
Format:USB/Flash Drive
Product Code:T201808608USB
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This is a pre-order for the USB edition of  ECS Transactions 86-8: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB.
 
This issue will be available for pick up at the AiMES 2018 ECS and SMEQ Joint International Meeting, to be held in Cancun, Mexico, September 30 – October 4, 2018. This item will not be shipped.
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