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(Print on Demand) Semiconductor Wafer Bonding 12: Science, Technology, and Applications – 222nd ECS Meeting/PRiME 2012

(Print on Demand) Semiconductor Wafer Bonding 12: Science, Technology, and Applications – 222nd ECS Meeting/PRiME 2012

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$136.00 - (Print on Demand) Semiconductor Wafer Bonding 12: Science, Technology, and Applications – 222nd ECS Meeting/PRiME 2012

$108.80 - (Print on Demand) Semiconductor Wafer Bonding 12: Science, Technology, and Applications – 222nd ECS Meeting/PRiME 2012

ISBN:978-1-62332-006-5
Year published:2012
Authors/Editors:Goorsky, Colinge, Knechtel, Baumgart, Hobart, Moriceau, Suga
Event Title:222nd ECS Meeting: 2012 Fall Meeting of ECSJ: PRiME 2012: Honolulu, HI
Format:Print-on-Demand/Softcover
Product Code:T201205007POD
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