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Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics – 214th ECS Meeting/PRiME 2008

Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics – 214th ECS Meeting/PRiME 2008

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The papers included in this issue of ECS Transactions were originally presented in the symposium “Low k Inter-Level Metal Dielectrics and New Contact and Barrier Metallurgies/Structures”, held during the PRiME 2008 joint international meeting of The Electrochemical Society and The Electrochemical Society of Japan, with the technical cosponsorship of the Japan Society of Applied Physics, the Korean Electrochemical Society, the Electrochemistry Division of the Royal Australian Chemical Institute, and the Chinese Society of Electrochemistry. This meeting was held in Honolulu, Hawaii, from October 12 to 17, 2008.


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$26.15 - Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics

$20.92 - Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics

ISBN:978-1-56677-693-6
Number of pages:61
Year published:2009
Authors/Editors:Mathad, Flake, and Rathore
Event Title:214th ECS Meeting : 2008 Fall Meeting of ECSJ : PRiME 2008 : Honolulu, Hawaii
Format:PDF
Product Code:T200801619
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