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Processing Materials of 3D Interconnects, Damascene and Electronics Packaging – 220th ECS Meeting

Processing Materials of 3D Interconnects, Damascene and Electronics Packaging – 220th ECS Meeting

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Quick Overview:
The papers included in this issue of ECS Transactions were originally presented in the symposium “Processing Materials of 3D Interconnects, Damascene and Electronics Packaging”, held during the 220th meeting of The Electrochemical Society, in Boston, Massachusetts, from October 9 to 14, 2011.
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$48.15 - Processing Materials of 3D Interconnects, Damascene and Electronics Packaging

ISBN:978-1-56677-985-2
Number of pages:136
Year published:2012
Authors/Editors:Kondo, Roozeboom, Akolkar, Koyanagi, Misra
Event Title:220th ECS Meeting: Boston, MA
Format:PDF
Product Code:T201104143
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