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This issue contains papers from The International Conference on Semiconductor Technology for Ultra Large Integrated Circuits and Thin Film Transistors (ULSIC vs. TFT) conference held in Barga, Italy in 2007. It is the first time experts have gotten together to discuss ideas and exchange opinions on scientific and engineering challenges in a cohesive way, with the end-goal of brainstorming on future research, development, and production directions of related technologies. This ECST issue gives an overview on reliability topics relating to scaling devices and systems and the challenges they pose, information on CMOS devices, high-k gate dielectrics, low-temperature poly-Si TFTs, and a-Si:H TFTs. It further discusses the challenges of physics on thin film deposition, grain growth, defect types, nanostructures, electrical characteristics, etc. Contributions also include topics on organic and inorganic transistors, imagers, high speed circuits, and more, and many papers were focused on large area electronic fabrication on flexible substrates, etc. Other topics included discussions on whether or not there will be conflicts between ULSI and TFT technologies in the future.