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Semiconductor Wafer Bonding: Science, Technology, and Applications 15 (USB)

Semiconductor Wafer Bonding: Science, Technology, and Applications 15 (USB)

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Quick Overview:
This is a pre-order for the USB edition of  ECS Transactions 86-5: Semiconductor Wafer Bonding: Science, Technology, and Applications 15.
 
This issue will be available for pick up at the AiMES 2018 ECS and SMEQ Joint International Meeting, to be held in Cancun, Mexico, September 30 – October 4, 2018. This item will not be shipped.
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ISBN:978-1-62332-536-7
Year published:2018
Authors/Editors:C. S. Tan, T. Suga, H. Baumgart, F. Fournel, M. Goorsky, K. D. Hobart, R. Knechtel
Event Title:AiMES 2018
Format:USB/Flash Drive
Product Code:T201808605USB
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Description
This is a pre-order for the USB edition of  ECS Transactions 86-5: Semiconductor Wafer Bonding: Science, Technology, and Applications 15.
 
This issue will be available for pick up at the AiMES 2018 ECS and SMEQ Joint International Meeting, to be held in Cancun, Mexico, September 30 – October 4, 2018. This item will not be shipped.
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